NexaGPU
NexaGPU
High-availability, dual-socket rackmount infrastructure engineered for custom cloud computing and high-density virtualization workloads.
In the rapidly evolving landscape of cloud infrastructure, generic standard server configurations frequently fail to deliver the high-performance computing, optimal thermal efficiency, and cost effectiveness required by modern enterprise architectures. As a premier global AI GPU server manufacturer and specialized Custom OEM Cloud Servers supplier, NexaGPU is committed to filling this engineering gap. We provide modular, purpose-built bare-metal cloud platforms, customized storage clusters, and high-performance server solutions designed to support demanding computing paradigms, from hybrid enterprise networks to large language models (LLM) like DeepSeek.
Founded in 2016, NexaGPU has combined 11 years of deep industry experience in high-performance computing and custom computer architecture with 6 years of robust global export experience. Our modern, high-efficiency boutique manufacturing & testing facility spans 320㎡, fully equipped to run hardware testing, extreme thermal analysis, and end-to-end system validation.
Data demands are transitioning from classic CPU-bound processing structures to intensive AI-centric acceleration architectures. The rapid scaling of global generative AI training pipelines, advanced deep learning models (such as the DeepSeek framework), real-time large data analytics, and global software-as-a-service (SaaS) environments require reliable, custom-configured cloud nodes. Generic computing equipment leads to under-utilized resources, network interface bottlenecks, thermal throttling, and unnecessarily high operating expenses (OpEx).
To solve this problem, modern technology leaders require bespoke compute infrastructure. Our OEM cloud servers are optimized down to the circuit board level to align with high-performance architectures, ensuring enterprise components work in perfect synergy. Whether our partners deploy large virtualization nodes (VMware/KVM), High-Performance Computing (HPC) research environments, hyperconverged hybrid cloud platforms, or industrial internet networks, NexaGPU designs physical chassis configurations and component specifications that meet these diverse operating requirements.
Optimized for Multi-GPU computing nodes, high-speed NVLink architectures, and DeepSeek inference pipelines using high-speed PCIe Gen 5 expansions.
Seamless virtualization integration across VMware, Proxmox, and OpenStack environments. Designed to prevent hardware overhead and boost CPU density.
Flexible SAS/SATA/NVMe hybrid bay designs supporting high-density hot-swap storage arrays for reliable enterprise data archiving and real-time database access.
Our collaborative development process ensures that you do not have to settle for off-the-shelf limits. NexaGPU's team of 120 dedicated R&D engineers designs and tests systems to integrate with your software. We collaborate closely with over 850 tier-1 supply chain partners, guaranteeing secure sourcing of high-demand silicon, memory, and board components.
From custom chassis sizing (1U, 2U, 4U, and modular computing blades) to BIOS/BMC firmware branding, optimized PCIe lane distribution, and advanced cooling design. We specialize in configuring multi-socket CPU topologies (Intel Xeon Scalable / AMD EPYC), custom memory channel loading (DDR5 RDIMM options), high-speed networking adapters (10GbE, 25GbE, 100GbE, InfiniBand), and customized direct-contact liquid cooling loops or high-airflow redundant fan assemblies.
In the past calendar year alone, our engineering team launched 85 customized product models. This rapid product design lifecycle allows us to turn your system performance goals into a tested, manufactured server ready for global deployment.
Deploying enterprise-grade cloud hardware across global regions requires compliance with local security guidelines, safety directives, and eco-design standards. Every system manufactured by NexaGPU undergoes multi-tier testing and verification. This comprehensive testing ensures safety, electromagnetic compatibility, and energy-efficiency compliance in our primary customer markets: North America, Europe, Southeast Asia, and the Middle East.
We build compliance into the design phase of our hardware. This includes sourcing components that meet RoHS and REACH standards for environmental safety, as well as designing power distribution units (PDUs) to meet CE, FCC, and UL requirements. Additionally, our motherboard architectures support secure hardware root of trust, TPM 2.0 cryptoprocessors, and secure boot technologies, helping protect your hybrid cloud environments from firmware-level vulnerabilities and cyber threats.
Modern datacenters are moving away from air-only cooling strategies as thermal design profiles (TDP) for advanced processors and accelerators push past 350W-500W per socket. NexaGPU's long-term product development is focused on designing high-density liquid-to-air and direct-contact liquid-to-liquid cold plate integration. This approach keeps server internal temperatures low, helping datacenters reduce their Power Usage Effectiveness (PUE) ratings.
Additionally, we are expanding our custom systems to support high-density CXL (Compute Express Link) architectures, NVMe-over-Fabrics (NVMe-oF) storage arrays, and SmartNIC/DPU network offload accelerators. These additions help cloud infrastructure providers optimize storage performance, reduce latencies, and maximize virtualization workloads per rack unit.
A look inside our 320㎡ production floor, showcasing high-precision assembly, detailed thermal stress testing, and component integration.
Technical and logistical insights from our hardware engineering division.
Next-generation multi-socket computing nodes and enterprise storage systems optimized for deep learning, virtualization, and hybrid cloud applications.
